Enabling Wearable Electronics: The Role of Thin-Film Encapsulation
The thin-film encapsulation (TFE) market is estimated to grow from USD 92 million in 2022 to reach USD 223 million by 2027; it is expected to grow at a CAGR of 19.4% from 2022 to 2027. The growth of the thin-film encapsulation (TFE) market can be attributed to growing use of thin-film barriers in flexible and organic electronic devices and the integration of flexible OLED displays into smartphones and smart wearables. Key players in the TFE market are Samsung SDI Co., Ltd. (South Korea); LG Chem (South Korea); 3M (US); Toppan Inc. (Japan); Ergis Group (Poland); Veeco Instruments Inc. (US); Universal Display Corporation (US); Applied Materials, Inc. (US); Kateeva (US); Toray Industries, Inc. (Japan); tesa (Germany); Ajinomoto Fine-Techno Co., Inc. (Japan); Coat-X (Switzerland); Borealis AG (Austria); BASF (Germany); AMS Technologies (Germany); Angstrom Engineering, Inc. (Canada); Beneq (Finland); Encapsulix (France); and Lotus Applied Technology (US). Most of the leading companie...